SN63PB37 Solder Bar is a high-purity, eutectic solder alloy containing 63% Tin (Sn) and 37% Lead (Pb). This composition offers a single, sharp melting point of 183°C, ensuring fast solidification and minimal solder defects. As a eutectic alloy, it transitions directly from solid to liquid without a plastic or pasty range, making it ideal for precision soldering in electronics manufacturing, wave soldering, and dip soldering applications.

Manufactured using 100% virgin raw materials, this solder bar ensures consistent alloy composition, low oxide formation, and excellent wetting properties.