Bond Solder Sticks / Bars are manufactured using advanced extrusion and vacuum casting processes, ensuring uniform alloy composition and exceptional purity. This technology eliminates contaminants like oxides, sulphides, and non-metallic inclusions, reducing dross formation and delivering glossy, long-lasting molten solder surfaces during wave and dip soldering.

Known for excellent fluidity, mechanical strength, and high reliability, Bond solder sticks outperform traditional solder bars in both performance and efficiency. Ideal for electronics, electrical, automotive, and specialized applications, Bond offers a wide range of alloy compositions to meet specific soldering needs—including eutectic, general-purpose, silver-compatible, and high-temperature options.

Key Features:

✅ High Purity & Glossy Finish – Less oxidation, longer usable life
✅ Low Dross Formation – Reduced material loss during wave soldering
✅ Wide Alloy Selection – From eutectic Sn63/Pb37 to aluminium and high-temp solders
✅ Mechanical Strength – Up to 51 MPa tensile strength for reliable joints
✅ Manufacturing Process – Extruded and vacuum-cast for consistency

Applications:

• Wave soldering & dip soldering
• Electrical & electronics assembly
• Automotive and mobile components
• Aluminium and silver-plated surfaces
• High-temperature applications (motors, lamps, radiators)