High-Precision Soldering with Maximum Reliability

The Almit 818 000 99 solder paste is an advanced, lead-free SAC-based solder paste formulated for modern SMT and PIP/THR applications. Engineered with LFM-48 alloy (Sn-3.0Ag-0.5Cu) and GT(R) flux, it delivers excellent wetting, high printing precision, and low soldering defects, even on fine-pitch components and challenging PCB surfaces.

Its 20–38 µm powder size and 12% ROL1 no-clean flux ensure strong, consistent solder joints and long stencil life. Ideal for high-reliability assemblies in electronics manufacturing.

 Key Features:

• Alloy: LFM-48 (Sn-3.0Ag-0.5Cu) – JEITA-recommended SAC alloy
• Melting Range: 217°C – 220°C
• Flux Type: GT(R), ROL1, No-Clean
• Flux Content: 12%
• Powder Size: 20–38 µm
• Classification: L1
• Form: Paste in 0.5 kg jar
• Applications: SMT, PIP/THR, fine-pitch PCB soldering
• Residue: Non-corrosive, low-residue formulation

Applications:

• High-precision SMT and reflow soldering
• Through-hole reflow (THR) and Pin-in-Paste (PIP)
• Fine-pitch components and high-reliability boards
• RoHS-compliant electronics production