High-Performance Low-Temperature Solder Paste for Sensitive Assemblies

Alpha OM-525 is a cutting-edge lead-free solder paste developed for low-temperature reflow applications, especially where temperature-sensitive components are involved. Using the innovative Alpha SBX02 alloy, with a melting point below 140°C, it delivers stronger mechanical reliability and better drop shock resistance compared to traditional SnBiAg alloys.

This solder paste is designed to eliminate the need for secondary wave or selective soldering processes, offering significant cost savings, faster production cycles, and enhanced throughput. Its long stencil life, low voiding under BGAs, and excellent solder drip resistance make it ideal for complex double-sided PCB assemblies.

Key Features:

• Alloy: Alpha SBX02
• Melting Point: < 140°C
• Reflow Profile: Peak between 155°C – 190°C
• Residue: No-clean, high electrical resistivity
• Stencil Life: 8+ hours
• Solder Balling: Excellent resistance
• Compatibility: Works with ENTEK HT, Immersion Silver/Tin, Ni/Au, SACX HASL, and more
• Void Performance: Low voiding in BGA joints
• Reflow Environment: Air or nitrogen

Applications:

• Double-sided SMT assemblies
• Temperature-sensitive component soldering
• Lead-free electronics manufacturing
• High-density and fine-pitch PCBs
• Energy-efficient production lines