Reliable Solder Paste for High-Precision Electronics Assembly

BIC Solder Paste is a high-performance Tin/Lead-based solder paste designed for SMT (Surface Mount Technology), PCB rework, and fine-pitch soldering. Formulated with a no-clean flux system, it ensures excellent wetting, smooth solder joints, and minimal post-solder residue, making it suitable for a wide range of electronic manufacturing and repair applications.

With stable viscosity and consistent printing performance, this paste reduces bridging, solder balls, and other common defects. Ideal for both manual and automated stencil printing.

Key Features:

• Alloy Composition: Sn63/Pb37 (Tin/Lead)
• Flux Type: No-Clean
• Weight: 500g (Also available in 250g & 1kg on request)
• Smooth, bright, and reliable joints
• Low residue – no post-cleaning needed
• Stable viscosity for consistent stencil printing
• Reduces bridging, solder balling, and slumping
• Suitable for fine-pitch components
• Compatible with reflow soldering

Applications:

• SMT stencil printing
• PCB assembly and repair
• Fine-pitch component soldering
• Prototyping and manufacturing