Trusted Since 1974 – Precision Soldering with Proven Performance

Bond’s flux-cored solder wire is engineered for high-performance soldering across electronics, automotive, telecom, and electrical industries. Manufactured to meet stringent IPC, JIS, MIL, and QQS 571 standards, these solder wires deliver exceptional wetting, thermal stability, and clean, reliable joints—even for the most demanding applications.

Choose from RA, RMA, No-Clean, Halogen-Free, Multicore, and Water-Soluble flux types, available in various tin-lead (Sn/Pb) and tin-lead-silver (SnPbAg) alloys with multiple diameters and flux percentages to suit your exact requirements.

Key Features:

✅ No Clean & Halogen-Free Options – Leaves clear, non-corrosive, non-conductive residue; no cleaning required.
✅ Multicore Flux Design – Symmetrical flux core layout ensures faster, more uniform wetting with minimal heat stress.
✅ Water Soluble Organic Flux – Superior wetting on diverse metals; fast soldering, minimal smoke, easy water rinse.
✅ Meets Global Standards – Conforms to IPC, JIS, MIL-P-28809, and QQS 571.
✅ Wide Compatibility – Suitable for PCBs, connectors, consumer electronics, and telecom assemblies.
✅ Customizable Grades – Available in Sn63/Pb37, Sn60/Pb40, Sn62/Pb36/Ag2.0, and more, with diameters from 0.5mm to 3.0mm.

Applications:

• Electronics manufacturing
• Consumer durables
• Automotive & telecom soldering
• Electrical repair & assembly
• PCB production and rework

Available Options:

• Flux Types: RA, RMA, No Clean, Halogen-Free, Water Soluble
• Compositions: Sn/Pb (various ratios), SnPbAg, Sn/Zn (solid wire)
• Flux Content: 1.1% to 3%
• Diameter: 0.50 mm to 3.0 mm