Precision Soldering with Superior Consistency and Reliability

The PAI SH6309 is a high-performance Sn63/Pb37 no-clean solder paste designed specifically for fine-pitch SMT assembly and PCB repair. Made using ultra-pure raw materials and Type 3 particle size, this solder paste ensures consistent stencil printing, minimal voiding, and excellent solder joint reliability.

Formulated with ROL0 no-clean flux, it meets industry standards for cleanliness and electrical performance while minimizing residues — reducing the need for post-solder cleaning. SH6309 is ideal for manual, automated, and high-precision reflow applications.

Key Features:

• Alloy Composition: Sn63/Pb37 (Tin 63%, Lead 37%)
• Flux Type: ROL0 – No-Clean
• Particle Size: Type 3 (45–20 µm range)
• Residue: Non-corrosive, non-conductive
• Printing Performance: Long stencil life and stable viscosity
• Packaging: 500g jar
• Shelf Life: Excellent (refrigerated storage recommended)
• Wetting: Full wetting across multiple surface finishes
• Application: Fine-pitch SMT, rework, repair, prototyping

Applications:

• Surface Mount Technology (SMT)
• PCB manufacturing and rework
• Fine-pitch component soldering
• High-reliability consumer and industrial electronics